mem: Add DRAM device size and check against config
[gem5.git] / src / mem / DRAMCtrl.py
1 # Copyright (c) 2012-2014 ARM Limited
2 # All rights reserved.
3 #
4 # The license below extends only to copyright in the software and shall
5 # not be construed as granting a license to any other intellectual
6 # property including but not limited to intellectual property relating
7 # to a hardware implementation of the functionality of the software
8 # licensed hereunder. You may use the software subject to the license
9 # terms below provided that you ensure that this notice is replicated
10 # unmodified and in its entirety in all distributions of the software,
11 # modified or unmodified, in source code or in binary form.
12 #
13 # Copyright (c) 2013 Amin Farmahini-Farahani
14 # All rights reserved.
15 #
16 # Redistribution and use in source and binary forms, with or without
17 # modification, are permitted provided that the following conditions are
18 # met: redistributions of source code must retain the above copyright
19 # notice, this list of conditions and the following disclaimer;
20 # redistributions in binary form must reproduce the above copyright
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24 # contributors may be used to endorse or promote products derived from
25 # this software without specific prior written permission.
26 #
27 # THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS
28 # "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT
29 # LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR
30 # A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT
31 # OWNER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL,
32 # SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT
33 # LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
34 # DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY
35 # THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT
36 # (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE
37 # OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
38 #
39 # Authors: Andreas Hansson
40 # Ani Udipi
41
42 from m5.params import *
43 from AbstractMemory import *
44
45 # Enum for memory scheduling algorithms, currently First-Come
46 # First-Served and a First-Row Hit then First-Come First-Served
47 class MemSched(Enum): vals = ['fcfs', 'frfcfs']
48
49 # Enum for the address mapping. With Ch, Ra, Ba, Ro and Co denoting
50 # channel, rank, bank, row and column, respectively, and going from
51 # MSB to LSB. Available are RoRaBaChCo and RoRaBaCoCh, that are
52 # suitable for an open-page policy, optimising for sequential accesses
53 # hitting in the open row. For a closed-page policy, RoCoRaBaCh
54 # maximises parallelism.
55 class AddrMap(Enum): vals = ['RoRaBaChCo', 'RoRaBaCoCh', 'RoCoRaBaCh']
56
57 # Enum for the page policy, either open, open_adaptive, close, or
58 # close_adaptive.
59 class PageManage(Enum): vals = ['open', 'open_adaptive', 'close',
60 'close_adaptive']
61
62 # DRAMCtrl is a single-channel single-ported DRAM controller model
63 # that aims to model the most important system-level performance
64 # effects of a DRAM without getting into too much detail of the DRAM
65 # itself.
66 class DRAMCtrl(AbstractMemory):
67 type = 'DRAMCtrl'
68 cxx_header = "mem/dram_ctrl.hh"
69
70 # single-ported on the system interface side, instantiate with a
71 # bus in front of the controller for multiple ports
72 port = SlavePort("Slave port")
73
74 # the basic configuration of the controller architecture
75 write_buffer_size = Param.Unsigned(64, "Number of write queue entries")
76 read_buffer_size = Param.Unsigned(32, "Number of read queue entries")
77
78 # threshold in percent for when to forcefully trigger writes and
79 # start emptying the write buffer
80 write_high_thresh_perc = Param.Percent(85, "Threshold to force writes")
81
82 # threshold in percentage for when to start writes if the read
83 # queue is empty
84 write_low_thresh_perc = Param.Percent(50, "Threshold to start writes")
85
86 # minimum write bursts to schedule before switching back to reads
87 min_writes_per_switch = Param.Unsigned(16, "Minimum write bursts before "
88 "switching to reads")
89
90 # scheduler, address map and page policy
91 mem_sched_policy = Param.MemSched('frfcfs', "Memory scheduling policy")
92 addr_mapping = Param.AddrMap('RoRaBaChCo', "Address mapping policy")
93 page_policy = Param.PageManage('open_adaptive', "Page management policy")
94
95 # enforce a limit on the number of accesses per row
96 max_accesses_per_row = Param.Unsigned(16, "Max accesses per row before "
97 "closing");
98
99 # size of DRAM Chip in Bytes
100 device_size = Param.MemorySize("Size of DRAM chip")
101
102 # pipeline latency of the controller and PHY, split into a
103 # frontend part and a backend part, with reads and writes serviced
104 # by the queues only seeing the frontend contribution, and reads
105 # serviced by the memory seeing the sum of the two
106 static_frontend_latency = Param.Latency("10ns", "Static frontend latency")
107 static_backend_latency = Param.Latency("10ns", "Static backend latency")
108
109 # the physical organisation of the DRAM
110 device_bus_width = Param.Unsigned("data bus width in bits for each DRAM "\
111 "device/chip")
112 burst_length = Param.Unsigned("Burst lenght (BL) in beats")
113 device_rowbuffer_size = Param.MemorySize("Page (row buffer) size per "\
114 "device/chip")
115 devices_per_rank = Param.Unsigned("Number of devices/chips per rank")
116 ranks_per_channel = Param.Unsigned("Number of ranks per channel")
117
118 # default to 0 bank groups per rank, indicating bank group architecture
119 # is not used
120 # update per memory class when bank group architecture is supported
121 bank_groups_per_rank = Param.Unsigned(0, "Number of bank groups per rank")
122 banks_per_rank = Param.Unsigned("Number of banks per rank")
123 # only used for the address mapping as the controller by
124 # construction is a single channel and multiple controllers have
125 # to be instantiated for a multi-channel configuration
126 channels = Param.Unsigned(1, "Number of channels")
127
128 # For power modelling we need to know if the DRAM has a DLL or not
129 dll = Param.Bool(True, "DRAM has DLL or not")
130
131 # DRAMPower provides in addition to the core power, the possibility to
132 # include RD/WR termination and IO power. This calculation assumes some
133 # default values. The integration of DRAMPower with gem5 does not include
134 # IO and RD/WR termination power by default. This might be added as an
135 # additional feature in the future.
136
137 # timing behaviour and constraints - all in nanoseconds
138
139 # the base clock period of the DRAM
140 tCK = Param.Latency("Clock period")
141
142 # the amount of time in nanoseconds from issuing an activate command
143 # to the data being available in the row buffer for a read/write
144 tRCD = Param.Latency("RAS to CAS delay")
145
146 # the time from issuing a read/write command to seeing the actual data
147 tCL = Param.Latency("CAS latency")
148
149 # minimum time between a precharge and subsequent activate
150 tRP = Param.Latency("Row precharge time")
151
152 # minimum time between an activate and a precharge to the same row
153 tRAS = Param.Latency("ACT to PRE delay")
154
155 # minimum time between a write data transfer and a precharge
156 tWR = Param.Latency("Write recovery time")
157
158 # minimum time between a read and precharge command
159 tRTP = Param.Latency("Read to precharge")
160
161 # time to complete a burst transfer, typically the burst length
162 # divided by two due to the DDR bus, but by making it a parameter
163 # it is easier to also evaluate SDR memories like WideIO.
164 # This parameter has to account for burst length.
165 # Read/Write requests with data size larger than one full burst are broken
166 # down into multiple requests in the controller
167 # tBURST is equivalent to the CAS-to-CAS delay (tCCD)
168 # With bank group architectures, tBURST represents the CAS-to-CAS
169 # delay for bursts to different bank groups (tCCD_S)
170 tBURST = Param.Latency("Burst duration (for DDR burst length / 2 cycles)")
171
172 # CAS-to-CAS delay for bursts to the same bank group
173 # only utilized with bank group architectures; set to 0 for default case
174 # tBURST is equivalent to tCCD_S; no explicit parameter required
175 # for CAS-to-CAS delay for bursts to different bank groups
176 tCCD_L = Param.Latency("0ns", "Same bank group CAS to CAS delay")
177
178 # time taken to complete one refresh cycle (N rows in all banks)
179 tRFC = Param.Latency("Refresh cycle time")
180
181 # refresh command interval, how often a "ref" command needs
182 # to be sent. It is 7.8 us for a 64ms refresh requirement
183 tREFI = Param.Latency("Refresh command interval")
184
185 # write-to-read, same rank turnaround penalty
186 tWTR = Param.Latency("Write to read, same rank switching time")
187
188 # read-to-write, same rank turnaround penalty
189 tRTW = Param.Latency("Read to write, same rank switching time")
190
191 # rank-to-rank bus delay penalty
192 # this does not correlate to a memory timing parameter and encompasses:
193 # 1) RD-to-RD, 2) WR-to-WR, 3) RD-to-WR, and 4) WR-to-RD
194 # different rank bus delay
195 tCS = Param.Latency("Rank to rank switching time")
196
197 # minimum row activate to row activate delay time
198 tRRD = Param.Latency("ACT to ACT delay")
199
200 # only utilized with bank group architectures; set to 0 for default case
201 tRRD_L = Param.Latency("0ns", "Same bank group ACT to ACT delay")
202
203 # time window in which a maximum number of activates are allowed
204 # to take place, set to 0 to disable
205 tXAW = Param.Latency("X activation window")
206 activation_limit = Param.Unsigned("Max number of activates in window")
207
208 # time to exit power-down mode
209 # Exit power-down to next valid command delay
210 tXP = Param.Latency("0ns", "Power-up Delay")
211
212 # Exit Powerdown to commands requiring a locked DLL
213 tXPDLL = Param.Latency("0ns", "Power-up Delay with locked DLL")
214
215 # time to exit self-refresh mode
216 tXS = Param.Latency("0ns", "Self-refresh exit latency")
217
218 # time to exit self-refresh mode with locked DLL
219 tXSDLL = Param.Latency("0ns", "Self-refresh exit latency DLL")
220
221 # Currently rolled into other params
222 ######################################################################
223
224 # tRC - assumed to be tRAS + tRP
225
226 # Power Behaviour and Constraints
227 # DRAMs like LPDDR and WideIO have 2 external voltage domains. These are
228 # defined as VDD and VDD2. Each current is defined for each voltage domain
229 # separately. For example, current IDD0 is active-precharge current for
230 # voltage domain VDD and current IDD02 is active-precharge current for
231 # voltage domain VDD2.
232 # By default all currents are set to 0mA. Users who are only interested in
233 # the performance of DRAMs can leave them at 0.
234
235 # Operating 1 Bank Active-Precharge current
236 IDD0 = Param.Current("0mA", "Active precharge current")
237
238 # Operating 1 Bank Active-Precharge current multiple voltage Range
239 IDD02 = Param.Current("0mA", "Active precharge current VDD2")
240
241 # Precharge Power-down Current: Slow exit
242 IDD2P0 = Param.Current("0mA", "Precharge Powerdown slow")
243
244 # Precharge Power-down Current: Slow exit multiple voltage Range
245 IDD2P02 = Param.Current("0mA", "Precharge Powerdown slow VDD2")
246
247 # Precharge Power-down Current: Fast exit
248 IDD2P1 = Param.Current("0mA", "Precharge Powerdown fast")
249
250 # Precharge Power-down Current: Fast exit multiple voltage Range
251 IDD2P12 = Param.Current("0mA", "Precharge Powerdown fast VDD2")
252
253 # Precharge Standby current
254 IDD2N = Param.Current("0mA", "Precharge Standby current")
255
256 # Precharge Standby current multiple voltage range
257 IDD2N2 = Param.Current("0mA", "Precharge Standby current VDD2")
258
259 # Active Power-down current: slow exit
260 IDD3P0 = Param.Current("0mA", "Active Powerdown slow")
261
262 # Active Power-down current: slow exit multiple voltage range
263 IDD3P02 = Param.Current("0mA", "Active Powerdown slow VDD2")
264
265 # Active Power-down current : fast exit
266 IDD3P1 = Param.Current("0mA", "Active Powerdown fast")
267
268 # Active Power-down current : fast exit multiple voltage range
269 IDD3P12 = Param.Current("0mA", "Active Powerdown fast VDD2")
270
271 # Active Standby current
272 IDD3N = Param.Current("0mA", "Active Standby current")
273
274 # Active Standby current multiple voltage range
275 IDD3N2 = Param.Current("0mA", "Active Standby current VDD2")
276
277 # Burst Read Operating Current
278 IDD4R = Param.Current("0mA", "READ current")
279
280 # Burst Read Operating Current multiple voltage range
281 IDD4R2 = Param.Current("0mA", "READ current VDD2")
282
283 # Burst Write Operating Current
284 IDD4W = Param.Current("0mA", "WRITE current")
285
286 # Burst Write Operating Current multiple voltage range
287 IDD4W2 = Param.Current("0mA", "WRITE current VDD2")
288
289 # Refresh Current
290 IDD5 = Param.Current("0mA", "Refresh current")
291
292 # Refresh Current multiple voltage range
293 IDD52 = Param.Current("0mA", "Refresh current VDD2")
294
295 # Self-Refresh Current
296 IDD6 = Param.Current("0mA", "Self-refresh Current")
297
298 # Self-Refresh Current multiple voltage range
299 IDD62 = Param.Current("0mA", "Self-refresh Current VDD2")
300
301 # Main voltage range of the DRAM
302 VDD = Param.Voltage("0V", "Main Voltage Range")
303
304 # Second voltage range defined by some DRAMs
305 VDD2 = Param.Voltage("0V", "2nd Voltage Range")
306
307 # A single DDR3-1600 x64 channel (one command and address bus), with
308 # timings based on a DDR3-1600 4 Gbit datasheet (Micron MT41J512M8) in
309 # an 8x8 configuration.
310 class DDR3_1600_x64(DRAMCtrl):
311 # size of device in bytes
312 device_size = '512MB'
313
314 # 8x8 configuration, 8 devices each with an 8-bit interface
315 device_bus_width = 8
316
317 # DDR3 is a BL8 device
318 burst_length = 8
319
320 # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8)
321 device_rowbuffer_size = '1kB'
322
323 # 8x8 configuration, so 8 devices
324 devices_per_rank = 8
325
326 # Use two ranks
327 ranks_per_channel = 2
328
329 # DDR3 has 8 banks in all configurations
330 banks_per_rank = 8
331
332 # 800 MHz
333 tCK = '1.25ns'
334
335 # 8 beats across an x64 interface translates to 4 clocks @ 800 MHz
336 tBURST = '5ns'
337
338 # DDR3-1600 11-11-11
339 tRCD = '13.75ns'
340 tCL = '13.75ns'
341 tRP = '13.75ns'
342 tRAS = '35ns'
343 tRRD = '6ns'
344 tXAW = '30ns'
345 activation_limit = 4
346 tRFC = '260ns'
347
348 tWR = '15ns'
349
350 # Greater of 4 CK or 7.5 ns
351 tWTR = '7.5ns'
352
353 # Greater of 4 CK or 7.5 ns
354 tRTP = '7.5ns'
355
356 # Default same rank rd-to-wr bus turnaround to 2 CK, @800 MHz = 2.5 ns
357 tRTW = '2.5ns'
358
359 # Default different rank bus delay to 2 CK, @800 MHz = 2.5 ns
360 tCS = '2.5ns'
361
362 # <=85C, half for >85C
363 tREFI = '7.8us'
364
365 # Current values from datasheet
366 IDD0 = '75mA'
367 IDD2N = '50mA'
368 IDD3N = '57mA'
369 IDD4W = '165mA'
370 IDD4R = '187mA'
371 IDD5 = '220mA'
372 VDD = '1.5V'
373
374 # A single DDR3-2133 x64 channel refining a selected subset of the
375 # options for the DDR-1600 configuration, based on the same DDR3-1600
376 # 4 Gbit datasheet (Micron MT41J512M8). Most parameters are kept
377 # consistent across the two configurations.
378 class DDR3_2133_x64(DDR3_1600_x64):
379 # 1066 MHz
380 tCK = '0.938ns'
381
382 # 8 beats across an x64 interface translates to 4 clocks @ 1066 MHz
383 tBURST = '3.752ns'
384
385 # DDR3-2133 14-14-14
386 tRCD = '13.09ns'
387 tCL = '13.09ns'
388 tRP = '13.09ns'
389 tRAS = '33ns'
390 tRRD = '5ns'
391 tXAW = '25ns'
392
393 # Current values from datasheet
394 IDD0 = '70mA'
395 IDD2N = '37mA'
396 IDD3N = '44mA'
397 IDD4W = '157mA'
398 IDD4R = '191mA'
399 IDD5 = '250mA'
400 VDD = '1.5V'
401
402 # A single DDR4-2400 x64 channel (one command and address bus), with
403 # timings based on a DDR4-2400 4 Gbit datasheet (Micron MT40A512M8)
404 # in an 8x8 configuration.
405 class DDR4_2400_x64(DRAMCtrl):
406 # size of device
407 device_size = '512MB'
408
409 # 8x8 configuration, 8 devices each with an 8-bit interface
410 device_bus_width = 8
411
412 # DDR4 is a BL8 device
413 burst_length = 8
414
415 # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8)
416 device_rowbuffer_size = '1kB'
417
418 # 8x8 configuration, so 8 devices
419 devices_per_rank = 8
420
421 # Match our DDR3 configurations which is dual rank
422 ranks_per_channel = 2
423
424 # DDR4 has 2 (x16) or 4 (x4 and x8) bank groups
425 # Set to 4 for x4, x8 case
426 bank_groups_per_rank = 4
427
428 # DDR4 has 16 banks (4 bank groups) in all
429 # configurations. Currently we do not capture the additional
430 # constraints incurred by the bank groups
431 banks_per_rank = 16
432
433 # 1200 MHz
434 tCK = '0.833ns'
435
436 # 8 beats across an x64 interface translates to 4 clocks @ 1200 MHz
437 # tBURST is equivalent to the CAS-to-CAS delay (tCCD)
438 # With bank group architectures, tBURST represents the CAS-to-CAS
439 # delay for bursts to different bank groups (tCCD_S)
440 tBURST = '3.333ns'
441
442 # @2400 data rate, tCCD_L is 6 CK
443 # CAS-to-CAS delay for bursts to the same bank group
444 # tBURST is equivalent to tCCD_S; no explicit parameter required
445 # for CAS-to-CAS delay for bursts to different bank groups
446 tCCD_L = '5ns';
447
448 # DDR4-2400 17-17-17
449 tRCD = '14.16ns'
450 tCL = '14.16ns'
451 tRP = '14.16ns'
452 tRAS = '32ns'
453
454 # RRD_S (different bank group) for 1K page is MAX(4 CK, 3.3ns)
455 tRRD = '3.3ns'
456
457 # RRD_L (same bank group) for 1K page is MAX(4 CK, 4.9ns)
458 tRRD_L = '4.9ns';
459
460 tXAW = '21ns'
461 activation_limit = 4
462 tRFC = '350ns'
463
464 tWR = '15ns'
465
466 # Here using the average of WTR_S and WTR_L
467 tWTR = '5ns'
468
469 # Greater of 4 CK or 7.5 ns
470 tRTP = '7.5ns'
471
472 # Default same rank rd-to-wr bus turnaround to 2 CK, @1200 MHz = 1.666 ns
473 tRTW = '1.666ns'
474
475 # Default different rank bus delay to 2 CK, @1200 MHz = 1.666 ns
476 tCS = '1.666ns'
477
478 # <=85C, half for >85C
479 tREFI = '7.8us'
480
481 # Current values from datasheet
482 IDD0 = '64mA'
483 IDD02 = '4mA'
484 IDD2N = '50mA'
485 IDD3N = '67mA'
486 IDD3N2 = '3mA'
487 IDD4W = '180mA'
488 IDD4R = '160mA'
489 IDD5 = '192mA'
490 VDD = '1.2V'
491 VDD2 = '2.5V'
492
493 # A single LPDDR2-S4 x32 interface (one command/address bus), with
494 # default timings based on a LPDDR2-1066 4 Gbit part (Micron MT42L128M32D1)
495 # in a 1x32 configuration.
496 class LPDDR2_S4_1066_x32(DRAMCtrl):
497 # No DLL in LPDDR2
498 dll = False
499
500 # size of device
501 device_size = '512MB'
502
503 # 1x32 configuration, 1 device with a 32-bit interface
504 device_bus_width = 32
505
506 # LPDDR2_S4 is a BL4 and BL8 device
507 burst_length = 8
508
509 # Each device has a page (row buffer) size of 1KB
510 # (this depends on the memory density)
511 device_rowbuffer_size = '1kB'
512
513 # 1x32 configuration, so 1 device
514 devices_per_rank = 1
515
516 # Use a single rank
517 ranks_per_channel = 1
518
519 # LPDDR2-S4 has 8 banks in all configurations
520 banks_per_rank = 8
521
522 # 533 MHz
523 tCK = '1.876ns'
524
525 # Fixed at 15 ns
526 tRCD = '15ns'
527
528 # 8 CK read latency, 4 CK write latency @ 533 MHz, 1.876 ns cycle time
529 tCL = '15ns'
530
531 # Pre-charge one bank 15 ns (all banks 18 ns)
532 tRP = '15ns'
533
534 tRAS = '42ns'
535 tWR = '15ns'
536
537 tRTP = '7.5ns'
538
539 # 8 beats across an x32 DDR interface translates to 4 clocks @ 533 MHz.
540 # Note this is a BL8 DDR device.
541 # Requests larger than 32 bytes are broken down into multiple requests
542 # in the controller
543 tBURST = '7.5ns'
544
545 # LPDDR2-S4, 4 Gbit
546 tRFC = '130ns'
547 tREFI = '3.9us'
548
549 # Irrespective of speed grade, tWTR is 7.5 ns
550 tWTR = '7.5ns'
551
552 # Default same rank rd-to-wr bus turnaround to 2 CK, @533 MHz = 3.75 ns
553 tRTW = '3.75ns'
554
555 # Default different rank bus delay to 2 CK, @533 MHz = 3.75 ns
556 tCS = '3.75ns'
557
558 # Activate to activate irrespective of density and speed grade
559 tRRD = '10.0ns'
560
561 # Irrespective of density, tFAW is 50 ns
562 tXAW = '50ns'
563 activation_limit = 4
564
565 # Current values from datasheet
566 IDD0 = '15mA'
567 IDD02 = '70mA'
568 IDD2N = '2mA'
569 IDD2N2 = '30mA'
570 IDD3N = '2.5mA'
571 IDD3N2 = '30mA'
572 IDD4W = '10mA'
573 IDD4W2 = '190mA'
574 IDD4R = '3mA'
575 IDD4R2 = '220mA'
576 IDD5 = '40mA'
577 IDD52 = '150mA'
578 VDD = '1.8V'
579 VDD2 = '1.2V'
580
581 # A single WideIO x128 interface (one command and address bus), with
582 # default timings based on an estimated WIO-200 8 Gbit part.
583 class WideIO_200_x128(DRAMCtrl):
584 # No DLL for WideIO
585 dll = False
586
587 # size of device
588 device_size = '1024MB'
589
590 # 1x128 configuration, 1 device with a 128-bit interface
591 device_bus_width = 128
592
593 # This is a BL4 device
594 burst_length = 4
595
596 # Each device has a page (row buffer) size of 4KB
597 # (this depends on the memory density)
598 device_rowbuffer_size = '4kB'
599
600 # 1x128 configuration, so 1 device
601 devices_per_rank = 1
602
603 # Use one rank for a one-high die stack
604 ranks_per_channel = 1
605
606 # WideIO has 4 banks in all configurations
607 banks_per_rank = 4
608
609 # 200 MHz
610 tCK = '5ns'
611
612 # WIO-200
613 tRCD = '18ns'
614 tCL = '18ns'
615 tRP = '18ns'
616 tRAS = '42ns'
617 tWR = '15ns'
618 # Read to precharge is same as the burst
619 tRTP = '20ns'
620
621 # 4 beats across an x128 SDR interface translates to 4 clocks @ 200 MHz.
622 # Note this is a BL4 SDR device.
623 tBURST = '20ns'
624
625 # WIO 8 Gb
626 tRFC = '210ns'
627
628 # WIO 8 Gb, <=85C, half for >85C
629 tREFI = '3.9us'
630
631 # Greater of 2 CK or 15 ns, 2 CK @ 200 MHz = 10 ns
632 tWTR = '15ns'
633
634 # Default same rank rd-to-wr bus turnaround to 2 CK, @200 MHz = 10 ns
635 tRTW = '10ns'
636
637 # Default different rank bus delay to 2 CK, @200 MHz = 10 ns
638 tCS = '10ns'
639
640 # Activate to activate irrespective of density and speed grade
641 tRRD = '10.0ns'
642
643 # Two instead of four activation window
644 tXAW = '50ns'
645 activation_limit = 2
646
647 # The WideIO specification does not provide current information
648
649 # A single LPDDR3 x32 interface (one command/address bus), with
650 # default timings based on a LPDDR3-1600 4 Gbit part (Micron
651 # EDF8132A1MC) in a 1x32 configuration.
652 class LPDDR3_1600_x32(DRAMCtrl):
653 # No DLL for LPDDR3
654 dll = False
655
656 # size of device
657 device_size = '512MB'
658
659 # 1x32 configuration, 1 device with a 32-bit interface
660 device_bus_width = 32
661
662 # LPDDR3 is a BL8 device
663 burst_length = 8
664
665 # Each device has a page (row buffer) size of 4KB
666 device_rowbuffer_size = '4kB'
667
668 # 1x32 configuration, so 1 device
669 devices_per_rank = 1
670
671 # Technically the datasheet is a dual-rank package, but for
672 # comparison with the LPDDR2 config we stick to a single rank
673 ranks_per_channel = 1
674
675 # LPDDR3 has 8 banks in all configurations
676 banks_per_rank = 8
677
678 # 800 MHz
679 tCK = '1.25ns'
680
681 tRCD = '18ns'
682
683 # 12 CK read latency, 6 CK write latency @ 800 MHz, 1.25 ns cycle time
684 tCL = '15ns'
685
686 tRAS = '42ns'
687 tWR = '15ns'
688
689 # Greater of 4 CK or 7.5 ns, 4 CK @ 800 MHz = 5 ns
690 tRTP = '7.5ns'
691
692 # Pre-charge one bank 18 ns (all banks 21 ns)
693 tRP = '18ns'
694
695 # 8 beats across a x32 DDR interface translates to 4 clocks @ 800 MHz.
696 # Note this is a BL8 DDR device.
697 # Requests larger than 32 bytes are broken down into multiple requests
698 # in the controller
699 tBURST = '5ns'
700
701 # LPDDR3, 4 Gb
702 tRFC = '130ns'
703 tREFI = '3.9us'
704
705 # Irrespective of speed grade, tWTR is 7.5 ns
706 tWTR = '7.5ns'
707
708 # Default same rank rd-to-wr bus turnaround to 2 CK, @800 MHz = 2.5 ns
709 tRTW = '2.5ns'
710
711 # Default different rank bus delay to 2 CK, @800 MHz = 2.5 ns
712 tCS = '2.5ns'
713
714 # Activate to activate irrespective of density and speed grade
715 tRRD = '10.0ns'
716
717 # Irrespective of size, tFAW is 50 ns
718 tXAW = '50ns'
719 activation_limit = 4
720
721 # Current values from datasheet
722 IDD0 = '8mA'
723 IDD02 = '60mA'
724 IDD2N = '0.8mA'
725 IDD2N2 = '26mA'
726 IDD3N = '2mA'
727 IDD3N2 = '34mA'
728 IDD4W = '2mA'
729 IDD4W2 = '190mA'
730 IDD4R = '2mA'
731 IDD4R2 = '230mA'
732 IDD5 = '28mA'
733 IDD52 = '150mA'
734 VDD = '1.8V'
735 VDD2 = '1.2V'