+The lower pincount, lower power, and higher BGA pitch is all to reduce
+the cost of product development when it comes to PCB design and layout:
+
+* Above 4 watts requires metal packages, thermal management and much
+ pricier PMICs.
+* 0.6mm pitch BGA and below requires much more expensive PCBA techniques.
+* Above 600 pins begins to reduce production yields as well as increase
+ the cost of testing and packaging.
+
+We can look at larger higher-power ASICs either later or, if funding
+is made available, immediately.
+