-# Copyright (c) 2012-2014 ARM Limited
+# Copyright (c) 2012-2018 ARM Limited
# All rights reserved.
#
# The license below extends only to copyright in the software and shall
# Erfan Azarkhish
from m5.params import *
-from AbstractMemory import *
+from m5.proxy import *
+from m5.objects.AbstractMemory import *
+from m5.objects.QoSMemCtrl import *
# Enum for memory scheduling algorithms, currently First-Come
# First-Served and a First-Row Hit then First-Come First-Served
# that aims to model the most important system-level performance
# effects of a DRAM without getting into too much detail of the DRAM
# itself.
-class DRAMCtrl(AbstractMemory):
+class DRAMCtrl(QoSMemCtrl):
type = 'DRAMCtrl'
cxx_header = "mem/dram_ctrl.hh"
# to be instantiated for a multi-channel configuration
channels = Param.Unsigned(1, "Number of channels")
+ # Enable DRAM powerdown states if True. This is False by default due to
+ # performance being lower when enabled
+ enable_dram_powerdown = Param.Bool(False, "Enable powerdown states")
+
# For power modelling we need to know if the DRAM has a DLL or not
dll = Param.Bool(True, "DRAM has DLL or not")
# for CAS-to-CAS delay for bursts to different bank groups
tCCD_L = Param.Latency("0ns", "Same bank group CAS to CAS delay")
+ # Write-to-Write delay for bursts to the same bank group
+ # only utilized with bank group architectures; set to 0 for default case
+ # This will be used to enable different same bank group delays
+ # for writes versus reads
+ tCCD_L_WR = Param.Latency(Self.tCCD_L,
+ "Same bank group Write to Write delay")
+
# time taken to complete one refresh cycle (N rows in all banks)
tRFC = Param.Latency("Refresh cycle time")
# A single DDR3-1600 x64 channel (one command and address bus), with
# timings based on a DDR3-1600 4 Gbit datasheet (Micron MT41J512M8) in
# an 8x8 configuration.
-class DDR3_1600_x64(DRAMCtrl):
+class DDR3_1600_8x8(DRAMCtrl):
# size of device in bytes
device_size = '512MB'
# <=85C, half for >85C
tREFI = '7.8us'
- # Current values from datasheet
- IDD0 = '75mA'
- IDD2N = '50mA'
- IDD3N = '57mA'
- IDD4W = '165mA'
- IDD4R = '187mA'
- IDD5 = '220mA'
+ # active powerdown and precharge powerdown exit time
+ tXP = '6ns'
+
+ # self refresh exit time
+ tXS = '270ns'
+
+ # Current values from datasheet Die Rev E,J
+ IDD0 = '55mA'
+ IDD2N = '32mA'
+ IDD3N = '38mA'
+ IDD4W = '125mA'
+ IDD4R = '157mA'
+ IDD5 = '235mA'
+ IDD3P1 = '38mA'
+ IDD2P1 = '32mA'
+ IDD6 = '20mA'
VDD = '1.5V'
# A single HMC-2500 x32 model based on:
# configuration.
# This configuration includes the latencies from the DRAM to the logic layer
# of the HMC
-class HMC_2500_x32(DDR3_1600_x64):
+class HMC_2500_1x32(DDR3_1600_8x8):
# size of device
# two banks per device with each bank 4MB [2]
device_size = '8MB'
# options for the DDR-1600 configuration, based on the same DDR3-1600
# 4 Gbit datasheet (Micron MT41J512M8). Most parameters are kept
# consistent across the two configurations.
-class DDR3_2133_x64(DDR3_1600_x64):
+class DDR3_2133_8x8(DDR3_1600_8x8):
# 1066 MHz
tCK = '0.938ns'
IDD4W = '157mA'
IDD4R = '191mA'
IDD5 = '250mA'
+ IDD3P1 = '44mA'
+ IDD2P1 = '43mA'
+ IDD6 ='20mA'
VDD = '1.5V'
# A single DDR4-2400 x64 channel (one command and address bus), with
-# timings based on a DDR4-2400 4 Gbit datasheet (Micron MT40A512M8)
-# in an 8x8 configuration.
-class DDR4_2400_x64(DRAMCtrl):
+# timings based on a DDR4-2400 8 Gbit datasheet (Micron MT40A2G4)
+# in an 16x4 configuration.
+# Total channel capacity is 32GB
+# 16 devices/rank * 2 ranks/channel * 1GB/device = 32GB/channel
+class DDR4_2400_16x4(DRAMCtrl):
# size of device
- device_size = '512MB'
+ device_size = '1GB'
- # 8x8 configuration, 8 devices each with an 8-bit interface
- device_bus_width = 8
+ # 16x4 configuration, 16 devices each with a 4-bit interface
+ device_bus_width = 4
# DDR4 is a BL8 device
burst_length = 8
- # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8)
- device_rowbuffer_size = '1kB'
+ # Each device has a page (row buffer) size of 512 byte (1K columns x4)
+ device_rowbuffer_size = '512B'
- # 8x8 configuration, so 8 devices
- devices_per_rank = 8
+ # 16x4 configuration, so 16 devices
+ devices_per_rank = 16
# Match our DDR3 configurations which is dual rank
ranks_per_channel = 2
# DDR4 has 2 (x16) or 4 (x4 and x8) bank groups
- # Set to 4 for x4, x8 case
+ # Set to 4 for x4 case
bank_groups_per_rank = 4
- # DDR4 has 16 banks (4 bank groups) in all
- # configurations. Currently we do not capture the additional
+ # DDR4 has 16 banks(x4,x8) and 8 banks(x16) (4 bank groups in all
+ # configurations). Currently we do not capture the additional
# constraints incurred by the bank groups
banks_per_rank = 16
# tBURST is equivalent to the CAS-to-CAS delay (tCCD)
# With bank group architectures, tBURST represents the CAS-to-CAS
# delay for bursts to different bank groups (tCCD_S)
- tBURST = '3.333ns'
+ tBURST = '3.332ns'
# @2400 data rate, tCCD_L is 6 CK
# CAS-to-CAS delay for bursts to the same bank group
tRP = '14.16ns'
tRAS = '32ns'
- # RRD_S (different bank group) for 1K page is MAX(4 CK, 3.3ns)
- tRRD = '3.3ns'
+ # RRD_S (different bank group) for 512B page is MAX(4 CK, 3.3ns)
+ tRRD = '3.332ns'
- # RRD_L (same bank group) for 1K page is MAX(4 CK, 4.9ns)
+ # RRD_L (same bank group) for 512B page is MAX(4 CK, 4.9ns)
tRRD_L = '4.9ns';
- tXAW = '21ns'
+ # tFAW for 512B page is MAX(16 CK, 13ns)
+ tXAW = '13.328ns'
activation_limit = 4
+ # tRFC is 350ns
tRFC = '350ns'
tWR = '15ns'
# <=85C, half for >85C
tREFI = '7.8us'
+ # active powerdown and precharge powerdown exit time
+ tXP = '6ns'
+
+ # self refresh exit time
+ # exit delay to ACT, PRE, PREALL, REF, SREF Enter, and PD Enter is:
+ # tRFC + 10ns = 340ns
+ tXS = '340ns'
+
# Current values from datasheet
- IDD0 = '64mA'
- IDD02 = '4mA'
- IDD2N = '50mA'
- IDD3N = '67mA'
+ IDD0 = '43mA'
+ IDD02 = '3mA'
+ IDD2N = '34mA'
+ IDD3N = '38mA'
IDD3N2 = '3mA'
- IDD4W = '180mA'
- IDD4R = '160mA'
- IDD5 = '192mA'
+ IDD4W = '103mA'
+ IDD4R = '110mA'
+ IDD5 = '250mA'
+ IDD3P1 = '32mA'
+ IDD2P1 = '25mA'
+ IDD6 = '30mA'
VDD = '1.2V'
VDD2 = '2.5V'
+# A single DDR4-2400 x64 channel (one command and address bus), with
+# timings based on a DDR4-2400 8 Gbit datasheet (Micron MT40A1G8)
+# in an 8x8 configuration.
+# Total channel capacity is 16GB
+# 8 devices/rank * 2 ranks/channel * 1GB/device = 16GB/channel
+class DDR4_2400_8x8(DDR4_2400_16x4):
+ # 8x8 configuration, 8 devices each with an 8-bit interface
+ device_bus_width = 8
+
+ # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8)
+ device_rowbuffer_size = '1kB'
+
+ # 8x8 configuration, so 8 devices
+ devices_per_rank = 8
+
+ # RRD_L (same bank group) for 1K page is MAX(4 CK, 4.9ns)
+ tRRD_L = '4.9ns';
+
+ tXAW = '21ns'
+
+ # Current values from datasheet
+ IDD0 = '48mA'
+ IDD3N = '43mA'
+ IDD4W = '123mA'
+ IDD4R = '135mA'
+ IDD3P1 = '37mA'
+
+# A single DDR4-2400 x64 channel (one command and address bus), with
+# timings based on a DDR4-2400 8 Gbit datasheet (Micron MT40A512M16)
+# in an 4x16 configuration.
+# Total channel capacity is 4GB
+# 4 devices/rank * 1 ranks/channel * 1GB/device = 4GB/channel
+class DDR4_2400_4x16(DDR4_2400_16x4):
+ # 4x16 configuration, 4 devices each with an 16-bit interface
+ device_bus_width = 16
+
+ # Each device has a page (row buffer) size of 2 Kbyte (1K columns x16)
+ device_rowbuffer_size = '2kB'
+
+ # 4x16 configuration, so 4 devices
+ devices_per_rank = 4
+
+ # Single rank for x16
+ ranks_per_channel = 1
+
+ # DDR4 has 2 (x16) or 4 (x4 and x8) bank groups
+ # Set to 2 for x16 case
+ bank_groups_per_rank = 2
+
+ # DDR4 has 16 banks(x4,x8) and 8 banks(x16) (4 bank groups in all
+ # configurations). Currently we do not capture the additional
+ # constraints incurred by the bank groups
+ banks_per_rank = 8
+
+ # RRD_S (different bank group) for 2K page is MAX(4 CK, 5.3ns)
+ tRRD = '5.3ns'
+
+ # RRD_L (same bank group) for 2K page is MAX(4 CK, 6.4ns)
+ tRRD_L = '6.4ns';
+
+ tXAW = '30ns'
+
+ # Current values from datasheet
+ IDD0 = '80mA'
+ IDD02 = '4mA'
+ IDD2N = '34mA'
+ IDD3N = '47mA'
+ IDD4W = '228mA'
+ IDD4R = '243mA'
+ IDD5 = '280mA'
+ IDD3P1 = '41mA'
+
# A single LPDDR2-S4 x32 interface (one command/address bus), with
# default timings based on a LPDDR2-1066 4 Gbit part (Micron MT42L128M32D1)
# in a 1x32 configuration.
-class LPDDR2_S4_1066_x32(DRAMCtrl):
+class LPDDR2_S4_1066_1x32(DRAMCtrl):
# No DLL in LPDDR2
dll = False
tRFC = '130ns'
tREFI = '3.9us'
+ # active powerdown and precharge powerdown exit time
+ tXP = '7.5ns'
+
+ # self refresh exit time
+ tXS = '140ns'
+
# Irrespective of speed grade, tWTR is 7.5 ns
tWTR = '7.5ns'
IDD4R2 = '220mA'
IDD5 = '40mA'
IDD52 = '150mA'
+ IDD3P1 = '1.2mA'
+ IDD3P12 = '8mA'
+ IDD2P1 = '0.6mA'
+ IDD2P12 = '0.8mA'
+ IDD6 = '1mA'
+ IDD62 = '3.2mA'
VDD = '1.8V'
VDD2 = '1.2V'
# A single WideIO x128 interface (one command and address bus), with
# default timings based on an estimated WIO-200 8 Gbit part.
-class WideIO_200_x128(DRAMCtrl):
+class WideIO_200_1x128(DRAMCtrl):
# No DLL for WideIO
dll = False
# A single LPDDR3 x32 interface (one command/address bus), with
# default timings based on a LPDDR3-1600 4 Gbit part (Micron
# EDF8132A1MC) in a 1x32 configuration.
-class LPDDR3_1600_x32(DRAMCtrl):
+class LPDDR3_1600_1x32(DRAMCtrl):
# No DLL for LPDDR3
dll = False
tRFC = '130ns'
tREFI = '3.9us'
+ # active powerdown and precharge powerdown exit time
+ tXP = '7.5ns'
+
+ # self refresh exit time
+ tXS = '140ns'
+
# Irrespective of speed grade, tWTR is 7.5 ns
tWTR = '7.5ns'
IDD4R2 = '230mA'
IDD5 = '28mA'
IDD52 = '150mA'
+ IDD3P1 = '1.4mA'
+ IDD3P12 = '11mA'
+ IDD2P1 = '0.8mA'
+ IDD2P12 = '1.8mA'
+ IDD6 = '0.5mA'
+ IDD62 = '1.8mA'
VDD = '1.8V'
VDD2 = '1.2V'
# A single GDDR5 x64 interface, with
# default timings based on a GDDR5-4000 1 Gbit part (SK Hynix
# H5GQ1H24AFR) in a 2x32 configuration.
-class GDDR5_4000_x64(DRAMCtrl):
+class GDDR5_4000_2x32(DRAMCtrl):
# size of device
device_size = '128MB'
# IDD measurement values, and by extrapolating data from other classes.
# Architecture values based on published HBM spec
# A 4H stack is defined, 2Gb per die for a total of 1GB of memory.
-class HBM_1000_4H_x128(DRAMCtrl):
+class HBM_1000_4H_1x128(DRAMCtrl):
# HBM gen1 supports up to 8 128-bit physical channels
# Configuration defines a single channel, with the capacity
# set to (full_ stack_capacity / 8) based on 2Gb dies
# instantiated per pseudo-channel
# Stay at same IO rate (1Gbps) to maintain timing relationship with
# HBM gen1 class (HBM_1000_4H_x128) where possible
-class HBM_1000_4H_x64(HBM_1000_4H_x128):
+class HBM_1000_4H_1x64(HBM_1000_4H_1x128):
# For HBM gen2 with pseudo-channel mode, configure 2X channels.
# Configuration defines a single pseudo channel, with the capacity
# set to (full_ stack_capacity / 16) based on 8Gb dies
# Default different rank bus delay to 2 CK, @1000 MHz = 2 ns
tCS = '2ns'
tREFI = '3.9us'
+
+ # active powerdown and precharge powerdown exit time
+ tXP = '10ns'
+
+ # self refresh exit time
+ tXS = '65ns'
projects / gem5.git / blobdiff