b. Power: 2 separate cores (CPU, GPU) leads to much higher
power consumption
- c. Cost: BOM and manufacturing/assembly costs (No: because usually
- they're "embedded" (shared memory bus architecture, same die)
-
- d. Capability: In RTOS devices, can't make effective use of the GPU
+ c. Capability: In RTOS devices, can't make effective use of the GPU
- e. the drivers involve an inter-core RPC mechanism: which is unacceptably high latency and complexity
+ d. the drivers involve an inter-core RPC mechanism: which is unacceptably high latency and complexity
- f. Furthermore, current RTOS microcontrollers have much lower mathematical numerically intensive computational performance at the same power and silicon area compared to our chip.
+ e. Furthermore, current RTOS microcontrollers have much lower mathematical numerically intensive computational performance at the same power and silicon area compared to our chip.
2. Time/Ease of Use/Development: Proprietary development tools and documentation result in an often difficult and long development cycle, especially when rebuilding and optimizing arithmetically intensive algorithms for embedded systems.