update 22nm page
authorLuke Kenneth Casson Leighton <lkcl@lkcl.net>
Mon, 25 Jan 2021 14:12:56 +0000 (14:12 +0000)
committerLuke Kenneth Casson Leighton <lkcl@lkcl.net>
Mon, 25 Jan 2021 14:12:56 +0000 (14:12 +0000)
22nm_PowerPI.mdwn

index 8186cfc5fd4b899cf5c67ddff3db43d683555176..44f89c6f666eed7579e0da75ceea383a50a1d9be 100644 (file)
@@ -22,12 +22,14 @@ up to 12-14 different products.
 
 **Three different pin packages:**
 
-* 400-450 pin FBGA 18mm 0.8mm and 14mm 0.6mm pitch,
-  single 32-bit DDR3/4 interface.  Suitable for smaller products:
-  0.8mm pitch is easier for low-cost China PCB manufacturing.
-  This lesson is learned from Freescale's 19-year-LTS iMX6 SoC
-* 600-650 pin FPGA appx 20mm 0.6mm pitch, dual 32-bit DDR3/4 interfaces.
-  Suitable for 4k HD resolution screens and Graphics Card capability.
+* 400-450 pin FBGA 18mm 0.8mm and 14mm 0.6mm pitch
+  - single 32-bit DDR3/4 interface.
+  - Suitable for smaller products.
+  - 0.8mm pitch is easier for low-cost China PCB manufacturing
+  - This lesson is learned from Freescale's 19-year-LTS iMX6 SoC
+* 600-650 pin FPGA appx 20mm 0.6mm pitch
+  - dual 32-bit DDR3/4 interfaces.
+  - Suitable for 4k HD resolution screens and Graphics Card capability.
 
 **Timeframe from when funding is received:**